SECTOR CAPABILITIES
TAILORED ADDITIVE MANUFACTURING
Electronics packaging requires exact interior clearances, robust snap-fit retention tabs, and dependable thermal management. Layerium Labs produces high-resolution enclosures, internal potting shells, and specialized light pipes that match the precision of production injection-molded parts.
COMMON APPLICATIONS
TYPICAL PARTS & ENGINEERING CHALLENGES
Custom PCB enclosures with tight internal clearance and integrated mounting standoffs
Snap-fit battery covers requiring high flexural fatigue endurance
Clear optical light guides and LED indicator pipes with polished transparency
Thermal airflow baffles directing convection over internal heat sinks
Potting shells and moisture-resistant silicone/TPU sealing gaskets
DESIGN CRITERIA
CRITICAL SECTOR REQUIREMENTS
Fine Feature Resolution
High-resolution printing delivers fine feature definition for delicate PCB mounting standoffs and micro fastener bosses.
Dielectric Insulation
Engineered polymers provide stable electrical insulation and high dielectric breakdown resistance.
Aesthetic Cosmetic Finish
Bead-blasting and vapor smoothing eliminate layer striations for clean consumer and B2B hardware enclosures.
RELEVANT MATERIALS
Engineered polymers and resins most frequently selected by electronics teams:
RECOMMENDED PROCESSES
High-Resolution SLA
Selective Laser Sintering (SLS)
Micro-Glass Bead Blasting
RECOMMENDED SERVICES